Reprints from my posting to SAN-Tech Mailing List and ...


[san-tech][03564] "Open-Silicon Announces Industry’s First Hybrid Memory Cube Controller IP", June 4, 2012

Date: Tue, 05 Jun 2012 03:39:56 +0900
Hybrid Memory Cube (HMC) に関して Micron Technology, Inc.と提携した
Open-Silicon, Inc.からのプレスリリースです:

"Open-Silicon Announces Industry’s First Hybrid Memory Cube Controller IP"
 Enabling Next-Generation Memory System Design for High-Performance Computing,
 Networking and Test & Measurement Applications
 June 4, 2012

  "... announced today the industry's first Hybrid Memory Cube (HMC) controller
   IP core - the industry's highest-performance and most flexible solution
   for integrating the many benefits of HMC technology into next-generation
   systems. ..."

  "... Open-Silicon's unique experience in complex ASIC development, combined
   with deep serial protocol IP expertise from developing six generations
   of Interlaken controllers, makes it a natural fit to offer this solution.
   As a result, Open-Silicon joined the Hybrid Memory Cube Consortium (HMCC)
   as a developer member and has been using that collective experience to help
   craft the advanced specification requirements for the HMC interface."
  "The Open-Silicon IP offers a seamless way to interface with HMC. Supporting
   up to 240GBps, the high-performance HMC controller IP also offers ultra-low
   latency and a flexible user interface. As a fully synchronous, soft-core
   implementation suitable for ASICs and FPGAs, along with robust error detection
   and automatic retry, the core supports up to four HMC links managed by
   a single controller. Each link consists of 16 lanes of 10, 12.5 or 15 Gbps."

Hybrid Memory Cube Controller IP

[san-tech][03160] "Open-Silicon and Micron Align to Deliver Next-Generation Memory Technology", June 7, 2011
  Date: Wed, 08 Jun 2011 19:32:01 +0900
Hybrid Memory Cube, Micron Technology, Inc.

Hybrid Memory Cube Consortium (HMCC)
"Micron and Samsung Launch Consortium to Break Down the Memory Wall"
 Oct 6, 2011
"Microsoft Joins Hybrid Memory Cube Consortium, Which Aims to Break Down Memory Wall"
 May 8, 2012

Hybrid Memory Cube Consortium関連記事
"Samsung, Micron bake 3D chips for next-gen RAM"
 Not-particularly-cube-shaped cubes prove faster
 7th October 2011, The Register
"IBM, Micron tag team on 3D memory breakthrough"
 Vertical DRAM juices bandwidth, efficiency
 1st December 2011, The Register

"New chippery on parade at ISSCC"
 CPU and memory makers strut their stuff
 22nd December 2011, The Register
[san-tech][03381] Intel Hybrid Memory Cube (HMC) に関する Blog, Sep. 15, 2011, Research@Intel
  Date: Wed, 21 Sep 2011 20:22:02 +0900

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